基于RSM-BBD的Ni-Cu-P/CeO2镀层的制备与性能Preparation and properties of Ni-Cu-P/CeO2 coating based on RSM-BBD
杨强,吕小虎,刘定富,姚助
摘要(Abstract):
在化学镀Ni-Cu-P三元镀层的基础上,向镀液中加入CeO_2纳米颗粒,并采用响应面实验设计(RSM-BBD)进行镀液配方优化,利用最佳的配方制备了Ni-Cu-P/CeO_2复合镀层。采用扫描电镜(SEM)、能谱仪(EDS)、X射线衍射仪(XRD)、电化学工作站和显微硬度仪等研究了复合镀层的表面形貌、微观组织结构、耐蚀性以及硬度。结果表明:Ni-Cu-P镀层和Ni-Cu-P/CeO_2复合镀层的表面光滑平整,没有胞状颗粒,复合镀层中有CeO_2颗粒镶嵌在其中,且复合镀层的晶粒更细小更致密;Ni-Cu-P镀层的硬度和孔隙率分别为479.1 HV0.1和0.12,加入CeO_2颗粒后复合镀层的硬度增加,孔隙率更低,分别为678.7 HV0.1和0.04;极化曲线测试结果表明,Ni-Cu-P/CeO_2复合镀层的耐蚀性比Ni-Cu-P镀层的耐蚀性更好,其腐蚀电位和腐蚀电流密度分别为-0.559 V和7.943×10~(-8)A·cm~(-2)。
关键词(KeyWords): Ni-Cu-P/CeO_2复合镀层;化学镀;CeO_2颗粒;响应面实验设计;耐蚀性
基金项目(Foundation):
作者(Author): 杨强,吕小虎,刘定富,姚助
DOI: 10.13289/j.issn.1009-6264.2021-0585
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