许少凡,许少平,江沣,张中宝

• 1:合肥工业大学材料学院
• 2:合肥工业大学机械与汽车学院

摘要(Abstract)：

用粉末冶金法制备了一定含量的镀铜和不镀铜Ti3SiC2-Cu-C复合材料,以及Cu-C复合材料,对它们的物理和力学性能进行了测试,并在滑动速度为10m/s,载荷为4.9N的干摩擦条件下进行了36h磨损试验,结果表明:镀铜Ti3SiC2-Cu-C复合材料的导电性、硬度、抗弯强度和耐磨性优于不镀铜Ti3SiC2-Cu-C复合材料和Cu-C复合材料。

关键词(KeyWords)： 导电陶瓷;复合材料;电阻率;抗弯强度;耐磨性

Abstract:

Keywords:

基金项目(Foundation):

作者(Author): 许少凡,许少平,江沣,张中宝

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