李玉娟,任凤章,王晓伟,李炎,魏世忠

• 1:河南科技大学材料科学与工程学院
• 2:中航光电科技股份有限公司连接技术研究院

摘要(Abstract)：

不同Al含量(0.16%、0.3%和0.5%)的Cu-Al合金薄板使用Cu2O粉末包埋法内氧化,制备Cu-Al2O3弥散强化铜合金,并对其微观组织进行分析。结果表明,合金的内氧化层表层晶粒均比内部晶粒明显细小,表面晶粒为5~30μm,内部晶粒为30~100μm;随内氧化时间增加,内氧化层深增加,但随Al含量增加而减小;内氧化层的微观组织为大量细小γ-Al2O3相弥散分布在铜基体上;内氧化层表层γ-Al2O3粒子大小为20~50 nm,间距为50~150 nm,γ-Al2O3粒子与基体Cu的界面匹配关系是(022)Cu//(220)γ,为共格界面。

关键词(KeyWords)： 弥散强化;Cu-Al2O3复合材料;内氧化法;显微组织

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金项目(51201061);; 长江学者和创新团队发展计划项目(IRT1234);; 河南省科技创新人才计划(144200510001);; 河南省重点攻关项目(092102210012)

作者(Author): 李玉娟,任凤章,王晓伟,李炎,魏世忠

DOI: 10.13289/j.issn.1009-6264.2014.09.006

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